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        扬杰股份官网主页
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        6寸晶圆
        ESD防护芯片
        ESD防护芯片

        Product status

        Unidirectional/bidirectional

        Channel

        Top Metal

        Back Metal

        Die Size

        Die Size (Width/um)

        Wafer Saw(um)

        Thickness(um)

        Vrwm(V)

        Vbr(V@1mA)

        IR(uA)

        Cj(pf)

        Ipp(A)

        Vcc(V@Ippmax)

        ESD(kV)

        ??
        型号 pdf Unidirectional
        /bidirectional
        Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr(V@1mA) IR(uA) Cj(pf) Ipp(A) Vcc(V@Ippmax) ESD(kV) 产品状态

        条数据